Amkor Technology, Inc. (AMKR) |
| 47.88 -3.86 (-7.46%) 08-28 16:00 |
| Open: | 51.29 |
| High: | 51.49 |
| Low: | 47.66 |
| Volume: | 4,874,836 |
| Market Cap: | 11,896(M) |
| PE Ratio: | 21.47 |
| Exchange: | NASDAQ Global Select |
| Industry: | Semiconductors |
| Sector: | Technology |
| Technical analysis | ||||
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| sell | buy | |||
| Resistance 2: | 64.98 |
| Resistance 1: | 56.45 |
| Pivot price: | 52.82 |
| Support 1: | 42.66 |
| Support 2: | 35.49 |
| 52w High: | 96.68 |
| 52w Low: | 23.37 |
Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
| EPS | 2.230 |
| Book Value | 18.750 |
| PEG Ratio | 0.76 |
| Gross Profit | 4.669 |
| Profit Margin (%) | 7.45 |
| Operating Margin (%) | 10.53 |
| Return on Assets (ttm) | 4.6 |
| Return on Equity (ttm) | 12.5 |
Fri, 28 Aug 2026
Amkor Technology (AMKR) And The AI Packaging Narrative Behind Its Undervalued View - Yahoo Finance
Fri, 28 Aug 2026
Amkor Technology Inc (AMKR) Shares Fall 7.5% -- What GF Score of 79 Tells Investors - GuruFocus
Fri, 28 Aug 2026
Amkor Technology Drops 6.8% Amid Sector-Wide Selling - AlphaStreet
Fri, 28 Aug 2026
Jefferies Financial Group Inc. Makes New $13.49 Million Investment in Amkor Technology, Inc. $AMKR - MarketBeat
Fri, 28 Aug 2026
How Investors Are Reacting To Amkor Technology (AMKR) AI-Fueled Earnings And Advanced Packaging Expansion - Sahm
Thu, 27 Aug 2026
Amkor Technology (AMKR) Earnings History & Trends - 24/7 Wall St.
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