Amkor Technology, Inc. (AMKR) |
| 64.455 -5.745 (-8.18%) 07-15 12:17 |
| Open: | 72 |
| High: | 72.4 |
| Low: | 64.3872 |
| Volume: | 1,298,412 |
| Market Cap: | 15,977(M) |
| PE Ratio: | 36.83 |
| Exchange: | NASDAQ Global Select |
| Industry: | Semiconductors |
| Sector: | Technology |
| Technical analysis | ||||
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| sell | buy | |||
| Resistance 2: | 96.68 |
| Resistance 1: | 83.39 |
| Pivot price: | 74.19 |
| Support 1: | 61.90 |
| Support 2: | 51.50 |
| 52w High: | 96.68 |
| 52w Low: | 20.59 |
Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
| EPS | 1.740 |
| Book Value | 18.290 |
| PEG Ratio | 0.76 |
| Gross Profit | 4.115 |
| Profit Margin (%) | 6.17 |
| Operating Margin (%) | 5.95 |
| Return on Assets (ttm) | 4.4 |
| Return on Equity (ttm) | 10.0 |
Wed, 15 Jul 2026
Are Computer and Technology Stocks Lagging Amkor Technology (AMKR) This Year? - Yahoo Finance Singapore
Tue, 14 Jul 2026
Is Amkor Technology Inc (AMKR) Overvalued After 6.3% Rally? GF V - GuruFocus
Tue, 14 Jul 2026
[144] AMKOR TECHNOLOGY, INC. SEC Filing - Stock Titan
Tue, 14 Jul 2026
AMKR Trades Cheaper Than Industry at 2.06X P/S: Is the Stock a Buy? - TradingView
Mon, 13 Jul 2026
A Look at Amkor Technology Inc (AMKR) After 6.3% Decline -- GF Value $32.29 vs Price $66.06 - GuruFocus
Mon, 13 Jul 2026
Premium Smartphone Demand Holds Up: What's Ahead for Amkor Technology? - Yahoo Finance
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